FEATURED NEWS AND INFORMATION:
FEATURED ARTICLES AND COLUMNS:

John Hendricks on 5G Materials

December 11, 2018 | Pete Starkey, I-Connect007

At the 2018 electronica exhibition in Munich, John Hendricks, product marketing manager for Rogers Corporation, discussed 5G materials including demands and trends.

Martyn Gaudion on Signal Integrity Modelling and Stackup Tools

December 11, 2018 | Pete Starkey, I-Connect007

The accuracy of signal integrity modelling continues to improve, and stackup tools are becoming widely used, which now include material suppliers' datasheet information. During the recent electronica show in Munich, Germany, Martyn Gaudion, managing director at Polar Instruments, explained how Polar often serves as a bridge between PCB design and fabrication, and why educating his customers is so critical.





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COLUMNS:

Flex Talk: The Myth About Rigid-Flex Costs

December 12, 2018 | Tara Dunn, Omni PCB

Do you cringe when you think of the option of rigid-flex? It is not an uncommon reaction when talking with designers and engineering managers about using rigid-flex to solve a packaging problem. Why? The most frequent answer is,...

Over the years, we have turned to many business experts, reading their words and stealing their ideas. We have talked about Peters, Godin, Tracy, and a few other business experts, and we have benefitted from all of them. Now, I...

Flexible Thinking: Achieving Continuous Flexible Circuit Innovation

December 7, 2018 | Joe Fjelstad, Verdant Electronics

Since their introduction, flexible circuits have continued a steady climb from relative obscurity to center stage in the world of electronic interconnections. Today, they are among the most popular choice for solving challenging...

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