New vertical conductive structure (VeCS) technology can reduce layer count and improve signal integrity without the need for sequential technologies. VeCS is different than traditional through-hole vias, microvias, and ELIC designs, which are more expensive and require a high number of laminations, drilling, and plating cycles to build up a reasonable number of layers.
There have been quite a few deals in North America in the PCB and EMS spaces over the past 12 months. I have attempted to track down a fair number of these deals and list them, but many are not publicized. What’s remarkable is that so many of these deals involve private equity. PE firms are certainly a great source of liquidity for owners in these sectors. PE-owned firms tend to make a lot of add-on acquisitions, so we’ll look at these companies to acquire many smaller shops in the coming years. Here are some of the most notable PCB, PCBA, and EMS deals since December 2018.
How can you tell if someone will be a great salesperson? What characteristics should you look for in potential candidates? Is there a way to guarantee that he or she will work out for you in the end? Here are five tips, including...
Many vendors and manufacturers featured test equipment for flexible circuits. It was worthwhile for me to take a long look at this equipment that evaluates new functional, flexible circuits. The first piece of equipment I examined was...
The State of Plating by Marc Ladle
Chemcut: Wet Processing Equipment for the Long Haul Interview with Rick Lies and Jerry Reitz
Putting Green Into a Brownfield Facility Interview with George Milad
The Advantages of Non-sludge Acid Copper Products Interview with Mike Wood
Pollution Prevention Techniques: Rinse Water Reduction by Happy Holden
Innovative Electroplating Processes for IC Substrates by Saminda Dharmarathna, et al.