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SEMI Recognizes U.S. Senator Majority Leader Charles Schumer With Government Leadership Award for Outstanding Support of U.S. Chip Industry

05/13/2024 | SEMI
SEMI, the industry association serving the global electronics design and manufacturing supply chain, announced that the SEMI North America Advisory Board has presented the annual SEMI Americas Government Leadership Award to U.S. Senate Majority Leader Charles (Chuck) Schumer in recognition of his extraordinary support of the U.S. semiconductor industry.

Kitron Announces Initiation of Share Buyback Program

05/13/2024 | Kitron
Kitron ASA initiates a share buyback in connection with remuneration to the board members.

TTM Technologies Appoints Wajid Ali to Board of Directors

05/10/2024 | TTM Technologies, Inc.
TTM Technologies, Inc. announced that Mr Wajid Ali has been appointed by the unanimous vote of the remaining Directors to serve as a new Class I director on the Board, effective immediately.

Flex Announces Upcoming Changes to Its Board of Directors

05/07/2024 | Flex
Flex announced that consistent with its succession plan, Michael D. Capellas, non-executive Chair of the Board of Directors of Flex, has informed the Board of his decision not to stand for re-election to the Board at the company's 2024 Annual General Meeting of shareholders to be held on August 8, 2024. Mr. Capellas has served on the company's board for 10 years, including as Chair since 2017, during which time he played a key role in building Flex's reputation as a trusted global technology, supply chain and manufacturing solutions partner and driving the company's success.

Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs

05/07/2024 | Happy Holden -- Column: Happy’s Tech Talk
A significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.
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