EIPC SpeedNews: News from the European PCB Industry


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News from Germany

  • Atotech to Present Leading Fan-out Wafer-level Packaging Technology at SEMICON Taiwan 2017

News from Switzerland

  • Boy's and Men's Dream Come True: An Essemtec Pick and Place Machine Breathes Life into Model Railways!

News from the UK

  • John Pardini Appointed Global Account Manager for IMS Materials at Ventec International

News from the US

  • Ventec in Detroit
  • Thoughts as Hurricane Irma Approaches Florida

News from WECC Members

Click here for the International Events Diary 2017

Click here to download the complete SpeedNews Issue 28

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Suggested Items

Bridging Knowledge and Understanding of Thermal Management Materials

03/14/2018 | Pete Starkey, I-Connect007
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.

RTW IPC APEX EXPO: Ventec's Jack Pattie on New Materials, Industry Upswing

03/13/2018 | Real Time with...IPC
Ventec International Group’s Jack Pattie comments on continuing growth in sales, investment in manufacturing and distribution, and new product developments in polyimides, no-flow pre-pregs and thermally conductive materials.

In Terms of Experience, a 10,000-foot View of China

01/17/2018 | Barry Matties, I-Connect007
In the past 30+ years of PCB manufacturing in China, you would be hard-pressed to find someone more connected to the pulse of the Asian market than Gene Weiner. Barry Matties met with the industry veteran at HKPCA to get his take on the show, the current and future market conditions of China, and any effect the new U.S. administration might have on trade relations going forward.



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