EIPC SpeedNews: News from the European PCB Industry


Reading time ( words)

News from Germany

  • Atotech to Present Leading Fan-out Wafer-level Packaging Technology at SEMICON Taiwan 2017

News from Switzerland

  • Boy's and Men's Dream Come True: An Essemtec Pick and Place Machine Breathes Life into Model Railways!

News from the UK

  • John Pardini Appointed Global Account Manager for IMS Materials at Ventec International

News from the US

  • Ventec in Detroit
  • Thoughts as Hurricane Irma Approaches Florida

News from WECC Members

Click here for the International Events Diary 2017

Click here to download the complete SpeedNews Issue 28

Share



Copyright © 2017 I-Connect007. All rights reserved.