EIPC SpeedNews: News from the European PCB Industry


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News from Germany

  • Atotech to Present Leading Fan-out Wafer-level Packaging Technology at SEMICON Taiwan 2017

News from Switzerland

  • Boy's and Men's Dream Come True: An Essemtec Pick and Place Machine Breathes Life into Model Railways!

News from the UK

  • John Pardini Appointed Global Account Manager for IMS Materials at Ventec International

News from the US

  • Ventec in Detroit
  • Thoughts as Hurricane Irma Approaches Florida

News from WECC Members

Click here for the International Events Diary 2017

Click here to download the complete SpeedNews Issue 28

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Suggested Items

In Terms of Experience, a 10,000-foot View of China

01/17/2018 | Barry Matties, I-Connect007
In the past 30+ years of PCB manufacturing in China, you would be hard-pressed to find someone more connected to the pulse of the Asian market than Gene Weiner. Barry Matties met with the industry veteran at HKPCA to get his take on the show, the current and future market conditions of China, and any effect the new U.S. administration might have on trade relations going forward.

Getting the Heat Out

01/12/2018 | Patty Goldman, I-Connect007
Increasing consumer demands for high performance and the need for high reliability in sectors such as automotive, LED lighting, and renewable energy mean that thermal management is now front and center on the priority list for PCB manufacturing.

Weiner’s World—December 2017

01/02/2018 | Gene Weiner, Weiner International Inc.
Hold on to your seats! 2018 will be a year full of rapid changes, surprises, and growth. M&A activities will flourish. The supply chain will suffer shortages and changes as demand increases, copycats will rush to market, and new markets and potential suppliers will vanish before they are established.



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