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It is with deep sadness that IPC announces the death of one of its valued committee members and leaders, Brian Butler, president and CEO of Introbotix. Brian passed away on March 11, 2018.
Brian joined the IPC D-21c High Speed/High Frequency Controlled Impedance Task Group in early 2000. He volunteered for numerous IPC task groups dedicated to high speed/high frequency design, serving as chair of the IPC D-24a Characteristic Impedance Test Methods Task Group and vice chair of the IPC D-24d High Frequency Signal Loss Task Group. In doing so, Brian led numerous efforts to develop and revise IPC-TM-650 Test Methods for usage by printed board fabricators in these technology areas.
His energy, enthusiasm and valuable contributions to the industry will be missed by many. On behalf of the electronics industry, IPC offers its condolences to Brian’s wife, Christine, their sons, Daniel and Ben, and Brian’s parents. A detailed obituary was posted by Christine here.
Jin Erbing, Joint Stars Technology Co., Ltd
With the four-wire and four-terminal flying probe test method, voids in the holes formed in the PCB due to process differences, thin copper, and poor conduction due to residual adhesive after laser drilling of the HDI board can be detected, and the circuit board guide can be solved. With the development of multilayer, high-density PCB layout, four-wire four-terminal flying probe testing will play an increasingly important role.
Patty Goldman, I-Connect007
I don’t have to tell you that things are changing fast in our industry. New tech seems to launch daily these days. How can we keep up? How can we even maintain? What’s coming next and how can we best prepare, in order to stay in the game?
Jan Pedersen, ELMATICA
IPC’s Automotive Addendum task group was started in November 2014 and the first edition of IPC 6012-DA was released in April 2016. We are now working on the revised version, and expect a release in Q2 2018. As standards need to evolve, develop and follow the needs of the industry, this work is continuous.