Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Trouble in Your Tank: Processes to Support IC Substrates, Advanced Packaging—Part 1

03/07/2023 | Michael Carano -- Column: Trouble in Your Tank
There has been much written and discussed over the last 18 months relating to semiconductor fabrication and the well-founded concerns that the U.S., in particular, has fallen behind in domestic chip manufacturing. In response to this issue, the United States government has enacted the CHIPS for America Act. Funding under this legislation is designed to drive more chip fabrication domestically. While this is all fine and good, once these advanced chips are manufactured, where will they go? As has been said ad nauseum, “Chips don’t float.”

A Challenge Facing Aerospace Designers In 2023

01/24/2023 | Lee Ritchey, Speeding Edge
As the aerospace industry has been tasked with fitting increasingly complex electronics in existing airframes the demands on PCB substrates have begun to overtask the existing state of the art in PCB fabrication. Recently, I was called in to troubleshoot some reliability problems with a very dense PCB that had components on both sides and required the use of stacked blind vias and buried vias. The usual name for this kind of design is “build-up fabrication,” requiring many trips through the lamination, drilling, and plating operations at a fabricator.

PCB Plating Still Comes Down to Physics

06/21/2022 | I-Connect007 Editorial Team
We asked columnist Michael Carano to discuss the latest innovations in plating equipment and chemicals, as well as some of the drivers in this segment, and the biggest challenges and opportunities he sees in plating today. As Michael points out, despite all of the technological advances in this industry, process engineers still need a solid understanding of Faraday’s Law and Ohm’s Law to successfully plate PCBs.

Trouble in Your Tank: Via Filling—Continued

10/25/2021 | Michael Carano -- Column: Trouble in Your Tank
In a previous column, the author presented several options with which to accomplish blind and through-hole via filling. In this edition of “Trouble in Your Tank,” filling blind and through holes with polymeric pastes will be presented.

With Flex, Sometimes You Gotta Break the Rules

04/05/2021 | Tony Plemel, Flexible Circuit Technologies
Sometimes in life, we need to break the rules. For example, in junior high I had a curfew but to have my first kiss, I had to break curfew. I got grounded, but it was worth it! My last article was about reasons to follow IPC design and inspection rules. This time, we are discussing instances where, due to complex requirements, customers are not always able to follow the rules. I will also discuss some design options that will hopefully keep you from “getting grounded.”
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in