-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
I-Connect007 Survey: What Does High Reliability Mean to You?
August 3, 2015 | I-Connect007Estimated reading time: Less than a minute
The term “high reliability” has been around this industry for decades, but there isn’t much consensus about exactly what the term means. If you ask 10 PCB designers, process engineers, or buyers what high-reliability means, you’ll likely get ten different answers. What is the difference, technologically, between a “typical” PCB and a high-rel PCB?
So, we decided to find out by asking our readers directly: What does high reliability mean to you? Take a minute and fill out this survey. We promise you—it’s short and sweet. You’ll be finished before you’re done with your coffee.
To take our survey, click here.
We appreciate your feedback!
Suggested Items
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
TRI Launches New Advanced Packaging 3D CT AXI Solution
03/26/2024 | TRITest Research, Inc. (TRI) proudly announces the launch of the SEMI 3D CT AXI solution, TR7600F3D SII Plus, marking a paradigm shift in precision and reliability for high-reliability electronics manufacturing, such as the Advanced Packaging Industry.
ECWC16 Technical Conference Special Sessions
03/20/2024 | Julia Gumminger, IPCThe ECWC16 Technical Conference at IPC APEX EXPO 2024 will feature two curated Special Technical Sessions on Thursday, April 11. Building on the success of similar sessions last year, these sessions will feature leaders in the advanced packaging and e-mobility segments, focusing on technological challenges and innovations. Both sessions were curated by the Technical Program Committee (TPC), consisting of subject matter experts in their fields.
Dr. Jennie Hwang to Deliver Courses on AI, High Reliability at IPC APEX EXPO 2024
03/05/2024 | Dr. Jennie HwangDr. Jennie Hwang will deliver two Professional Development Courses on “Artificial Intelligence Era—Opportunities, Challenges, Possibilities” (PD21), and “High Reliability Electronics for Harsh Environments” (PD7) at IPC APEX 2024 on Sunday, April 7 and Monday, April 8, respectively. Hwang, chair of the AI Committee of National Academies/DoD AI study, Panel of National AI Institute of NSF, and Committee of Strategic Thinking for Engineering Research in the Era of Artificial Intelligence of NSF, brings broad-based information and insights through an integrated perspective to the AI course.
Reassessing Surface Finish Performance for Next-gen Technology, Part 2
03/04/2024 | Frank Xu, PhD and Martin Bunce of MacDermid Alpha, and John Coonrod of Rogers Corp.The introduction of 5G/6G has created a growing demand for faster rates of data transfer and operation at higher frequencies, pushing signals to travel toward the outer edges of conductors. As a result, the surface finish applied over the copper circuitry is now gaining more attention.