Written by Morgana Ribas and other expert authors from Alpha Assembly Solutions, this book provides an introduction to the evolution of modern low-temperature soldering. Readers will learn the benefits low-temperature alloys have to offer, such as reducing costs, creating more reliable solder joints, and overcoming design limitations with traditional alloys.
Considering thermal issues in the earliest stages of the design process is critical. Written by Didier Mauve, sales and marketing manager at Ventec International Group, and Ian Mayoh, technical support manager, this book highlights the need to dissipate heat from electronic devices.
Written by John Bushie, director of technology at American Standard Circuits, and Anaya Vardya, president and CEO, this micro eBook provides information needed to understand the unique challenges of RF PCBs. The authors answer two main questions: what is the correct material to use for a particular project, and what can be done at the design stage to make a product more manufacturable?
Written by signal/power integrity specialist Fadi Deek of Mentor, A Siemens Business, this micro eBook provides a thorough investigation of power distribution network performance. Deek addresses problematic issues within electronic transmissions, and presents a variety of simulations and analyses in every chapter.
Signal integrity issues remain a concern for many in the electronics industry. This micro eBook details the importance of eliminating signal integrity challenges. Written by signal integrity engineer Fadi Deek of Mentor Siemens, the chapters explore four possible signal integrity problems using an understanding of essential signal integrity principles.
This is an easily digestible guide for individuals involved in the procurement or specification of conformal coatings, especially for PCBs that are required to perform in harsh environments. This book can help you find a safe path through the minefield of available coatings, while dispelling many commonly held myths and addressing a variety of critical issues.
This book, The Printed Circuit Designer’s Guide to…Secrets of High-Speed PCBs: Part 2, is a must-read, not just for designers, but for anyone involved with, or confused by, high-speed PCBs: purchasing agents, salespeople, marketing professionals, recent graduates, etc.
If you’re a PCB designer or design engineer, chances are you’re probably dealing with high-speed PCBs and their attendant issues. Part 1 of this book covers Specifying, Modelling and Measuring. Not just for designers, this book will appeal to buyers, salespeople, recent graduates and marketing professionals.
This concise and highly useful book on flexible circuits from American Standard Circuits was written to provide circuit designers, both new and seasoned, with valuable and important information that will help to assure their first pass success in getting their products to market.
This eBook has something to offer for the seasoned designer and the newbie. After reading this eBook, PCB designers will have all the DFM knowledge they need to eliminate costly design re-spins and get a good board back, every time.
This micro eBook is first in the Buyer's Guide series that was written to give you the essential information needed regarding AS9100 certification in a concise and easy-to-read format. Print-on-demand also available.
Solder has been a loyal servant of the electronics manufacturing industry for years; however, like any aging servant, the efficacy of solder has been waning as the industry looks to make products.
Flexible Circuit Technology, 4th Edition provides the basic knowledge required to design, manufacture and use flexible circuits while avoiding many of the potential problems that may be encountered by those who attempt to learn from their own experiences.
The widespread use of new electronic components employing Ball-Grid Array (BGA), Chip Scale Packaging (CSP), and other evolving technology form-factors means new fabrication techniques must be used to create printed circuit boards (PCBs) that will accommodate parts with extremely tight lead pitches and small geometries.
In the global economy that is today’s business environment, there are no guarantees. In this environment, the big continue to get bigger through acquisition or elimination of the competition. Never before has US manufacturing had to look over our shoulder as we do now.
Reflow soldering of through hole components can simplify the entire assembly process for companies running tin/lead or lead-free and continue to maintain the quality and reliability of the products being built. The reflow-only process can also eliminate the cost and waste associated with wave and selective soldering.
Right the First Time explains why many PCB designers and design engineers currently see getting a design right the first time as a foreign concept. The trial-and-error design method has been the rule, not the exception, since the advent of transistor-transistor logic (TTL).