I-Connect007 Editor’s Choice: Five Must-Reads For the Week

February 3, 2023 | Nolan Johnson, I-Connect007

It’s Feb. 3, 2023—2/3/23—and now we know the results of yesterday’s Groundhog weather forecast straight from Gobbler’s Knob in Pennsylvania. Punxsutawney Phil says six more weeks of winter. If you’re watching the ongoing ice storms blanketing much of the United States at present, that seems like a safe bet. Also a safe bet is that the most-read news this week is IPC APEX EXPO related. Additionally, this week IPC published its EMS and PCB numbers for December. All told, lots of industry news to read this week.

Andy Shaughnessy sits down with Massimo Passerini, founder of Wise, and Technica's Jason Perry, to discuss Wise's latest PCB manufacturing automation. They also focus on the company's distributor partnership with Technica, which is moving into the PCB fab market. If you were unable to attend IPC APEX EXPO 2023, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.



The Government Circuit: Building Industry Resilience in 2023

January 31, 2023 | Chris Mitchell, IPC

As the 118th U.S. Congress begins, we at IPC look forward to working with members of both parties to ensure the electronics manufacturing industry’s long-term success by advancing policies that increase innovation, investment,...

It’s Only Common Sense: Short Circuiting the Excuse Cycle

January 30, 2023 | Dan Beaulieu, DB Management

Sales managers, have you ever heard one of your salespeople say something like: “If we only had (whatever it is your company doesn’t have), I could double my forecast?” How about, “If we only had the spec or...

Punching Out: Here’s the Deal About 2022

January 23, 2023 | Tom Kastner, GP Ventures, Ltd.

Last year turned out to be a fairly slow year for mergers and acquisitions (M&A) in the North American PCB and EMS sectors. We counted just seven completed or announced deals in the PCB sector last year, compared to 13 in 2021,...

Nolan’s Notes: An Evolution

January 18, 2023 | Nolan Johnson, I-Connect007

This month, PCB007 Magazine looks at the evolution of advanced packaging from the fabricator’s perspective. This is, as you’re aware, a global topic. Asia harbors nearly all the manufacturing capabilities for the packaging...

The Advanced Move Featuring:

Substrate Manufacturing: What Does It Take? with Jan Vardman
Heterogenous Integration Technologies Driving Advanced Packaging Solutions by Charles Woychik
MKS' Atotech: Chemically Connecting the Industry with Tobias Helbech
The Impact of Chip Packaging by Chuck Bauer
Everyone Wants Change: Who Wants to Lead the Way? with Mark Goodwin and Alun Morgan
An Advanced Packaging Year in Review by John Mitchell

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