Standard of Excellence: Partnering to Produce New and Innovative Products

October 27, 2021 | Team ASC, American Standard Circuits

One of the best features, the best benefits of working closer in partnership with your vendor partners is working with them to develop new products for the industry.

EIPC Technical Snapshot Review: Packaging Trends and a PTFE Masterclass

October 27, 2021 | Pete Starkey, I-Connect007

In circumstances that forced the postponement of its live conferences, seminars and workshops, EIPC has continued to provide its platform for the exchange and dissemination of market knowledge and technical information to the European interconnection and packaging industry. October 22 brought the 12th in the sequence, introduced and moderated by Martyn Gaudion, EIPC board member and CEO of Polar Instruments.



Trouble in Your Tank: Via Filling—Continued

October 25, 2021 | Michael Carano, RBP Chemical Technology

In a previous column, the author presented several options with which to accomplish blind and through-hole via filling. In this edition of “Trouble in Your Tank,” filling blind and through holes with polymeric pastes will...

You can read all of the business books on strategy that you want, but if you really want to cut to the chase when it comes to creative ideas for setting your business direction there are no better books than those on advertising by...

The Big Picture: Part 2, Geopolitics and the PCB Supply Chain

October 7, 2021 | Mehul Davé, Entelechy Global and Linkage Technologies

Since my last column on this topic was so popular, I figured I should double down on it. If you’ve been living under a rock, let me tell you, stay there! China is currently undergoing a spat of power issues due to a perfect...

Trouble in Your Tank: Case Study—Interconnect Defects and a Few Other Problems

October 7, 2021 | Michael Carano, RBP Chemical Technology

For this month’s edition, we are taking a slightly different approach—that of presenting an actual case study. However, the basic principles of these columns continue....

The CapEx Issue Featuring:

  • Candor Demonstrates Growth and Investment Go Hand-in-Hand, with Sunny Patel 
  • The Truth About Capital Expenditures, with Joe Dickson, WUS Printed Circuit Co. 
  • Do You Really Need New Equipment? with Alex Stepinski 
  • Direct Imaging and Beyond, with Brendan Hogan, MivaTek 
  • Managing Capital Expenditures: Not Just Machines Anymore, with Peter Bigelow, IMI 
  • Made in the USA, a conversation with Thomas Walsh and Travis Houchin, IPS
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