-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Altus Group Adds Solderstar's Reflow Shuttle O2 Measurement Module to its Product Portfolio
November 6, 2023 | Altus GroupEstimated reading time: 1 minute
Altus Group, a leading distributor of electronics assembly equipment in the UK and Ireland, has announced a significant enhancement to its product offerings with the introduction of Solderstar's cutting-edge technology, the Reflow Shuttle O2 measurement module.
This innovative module represents the first repeatable verification tool that combines O2 ppm, vibration levels in 3 axes, vacuum, temperature profiles, and conveyor speed on a single robust platform. This gives manufacturers real-time insight into their reflow soldering processes, marking a significant advancement in the industry.
The Reflow Shuttle O2 measurement module, to be unveiled by Solderstar at Productronica 2023 in Munich, enables the detection of nitrogen leaks and precise pinpointing of oxygen fluctuations throughout oven zones. Manufacturers can leverage the module's real-time oxygen level data to optimise nitrogen usage, prevent flux build-up, and make informed decisions to enhance operations. Importantly, by precisely monitoring and controlling O2 levels, the module allows manufacturers to ensure consistent product quality with strong, reliable solder joints free of defects and weaknesses caused by oxidation.
Joe Booth, CEO of Altus Group, said: "We are pleased to introduce Solderstar's Reflow Shuttle O2 measurement module to our product portfolio. This innovative technology aligns perfectly with our mission to provide cutting-edge solutions to our customers. It offers a real-time window into reflow soldering processes, facilitating informed decision-making and operational optimisation, ultimately ensuring superior product quality.
“We look forward to introducing our customers to this innovative product at the Solderstar stand during Productronica, allowing them to get a close look at the module’s capabilities for optimising reflow soldering processes.”
The Reflow Shuttle’s versatile design allows seamless integration into fully operational reflow ovens, eliminating the need for downtime during verification. Manufacturers can initiate data collection with a simple button press, obtaining a comprehensive pass-through graph of the entire oven. This overview enables early detection of any anomalies, allowing manufacturers to promptly make adjustments when needed.
Altus invites its customers to explore the Reflow Shuttle O2 measurement module and its benefits at Productronica 2023, from November 14th to 17th in Munich, Germany. To arrange an appointment for in-depth insights, live demonstrations, and answers to technical inquiries, please contact Altus.
Suggested Items
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Altus Group Helps BitBox Unlock Productivity and Efficiency Gains with New Reflow Oven
04/22/2024 | Altus GroupAltus Group, a leading provider of capital equipment, has recently assisted BitBox, a UK-based electronics design, engineering and manufacturing company in upgrading its operations with the implementation of a new reflow oven from Heller Industries.
Solderstar to Showcase Advanced Solutions at EPP InnovationsFORUM 2024
03/18/2024 | SolderStarSolderstar, a leading manufacturer of temperature profiling systems and software for the Electronic Manufacturing sector, is set to showcase its latest innovation at the EPP InnovationsFORUM 2024 in Leinfelden-Echterdingen, Germany on 17th April. Taking centre stage will be the Reflow Shuttle O2 an advanced process verification tool designed to enhance quality control in electronics manufacturing.
Revolutionizing Soldering: Kurtz Ersa to Debut Cutting-Edge Lineup at APEX
03/12/2024 | Kurtz ErsaKurtz Ersa Inc., a leading supplier of electronics production equipment, is pleased to announce plans to showcase its latest advancements and a range of cutting-edge soldering machines at the 2024 IPC APEX EXPO.
BTU to Unveil Aurora in the US at the 2024 IPC APEX EXPO
03/12/2024 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will introduce its award-winning Aurora Reflow Oven Platform, at the upcoming 2024 IPC APEX EXPO.