Reading time ( words)
- FED starts IPC online testing
- Brian Haken
- Review Institute of Circuit Technology 41st Annual Symposium
- President and CEO of Isola Group announces retirement
- Enabling manufacturing processes for smart flexible displays
- New IPC Report Details How PCB Manufacturers Meet Today's Technology Demands
- Submit a paper at IPC EXPO 2016
- The JPCA Show this month in Tokyo showed an increase in the number of visitors as well as the number of exhibitors
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Suggested Items
PCBAA Reacts to Implications of Biden’s PCB Determination
04/05/2023 |
Nolan Johnson, I-Connect007
Hot on the heels of the news that U.S. President Biden signed a presidential determination in support of the printed circuit board industry, I-Connect007’s Nolan Johnson spoke with David Schild, executive director of the Printed Circuit Board Association of America, about some of the expected implications. David points out, among other things, that this signals increased momentum with government and defense to support U.S.-based printed circuit manufacturing, and the possibility that a renewed interest in the industry by private financing could possibly follow.
Invested in Growth
04/04/2023 |
Barry Matties, I-Connect007
The I-Connect007 team paid a visit to American Standard Circuits in West Chicago, Illinois. While there, we talked at length with CEO Anaya Vardya about the issues on his mind as he pushes technology, expands his floor space, and considers the implications of the CHIPS Act, staffing issues, and what’s happening in China.
Organizing Materials Differently at Ventec
03/29/2023 |
Pete Starkey, I-Connect007
At a recent industry conference, technical editor Pete Starkey caught some time with Ventec’s Mark Goodwin and Didier Mauve. In this conversation, Mark and Didier discuss Ventec’s work to curate their product offerings into functional categories based on function and target application. The pair also share their thinking on markets which they see as driving material development work. When material performance becomes an integral part of the PCB’s performance specifications, the traditional way of categorizing materials may not do the job.
