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i3 Electronics, Inc. (i3) announced today that it has earned the opportunity from an industry leading medical OEM for the development and manufacture of advanced, flexible, circuitized substrates. The product is a flexible, LCP substrate that will be used in the neurostimulation market.
“i3’s advanced flex technology is revolutionizing the medical industry. Our commitment to supplying our customers with the industry’s highest-reliability products enables them to improve the lives of thousands of people every day,” said Dale Kersten, Executive Vice President and Chief Business Officer at i3 Electronics.
About i3 Electronics
i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, high speed laminates, advanced assembly, reliability and signal integrity reliability labs, high speed back plane & press fit assembly, and flexible electronics & assembly. i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.
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