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AT&S, one of the global leading manufacturers of high-end printed circuit boards (PCBs) with headquarters in Leoben, Austria, is committed to absolute customer orientation supporting its vision: “First choice for advanced applications.”
In order to better serve the existing and potential customers from the segments mobile devices (smartphones, tablets, ultrabooks, wearables, etc.), automotive (applications like advanced driver assistance systems, safety features, etc.), industrial (power applications, lighting, machine-to-machine communication), and medical (diagnostic and therapy applications like hearing aids, pace makers and online patient monitoring), AT&S recently established a new partnership with the U.S. sales representatives Adapt Electronics, Inc. and Schillinger Associates, Inc. (SAI).
Adapt Electronics, Inc. will support an increased customer contact in the Pacific Northwest, namely Washington, Idaho and Oregon, with a focus on the industrial, medical and wearables industries, whereas Schillinger Associates, Inc. will back AT&S’s sales and customer activities in the Ohio Valley (e.g. Indiana, Kentucky, Michigan, Ohio, Pennsylvania, etc.), known for a wide base of customers in the automotive, medical and industrial Industries.
“Our main focus is always on the customer. Therefore we have established this strategic cooperation with our new partners to ensure that customers always get the best services in the PCB industry from AT&S”, says Walter Moser, CSO of the Business Unit Automotive, Industrial and Medical at AT&S. “Thanks to our new local representatives, we can furthermore better localize, develop and increase the speed to market for AT&S,” he adds. “Especially in a country the size of the U.S., this is an absolute prerequisite to ensure that all AT&S technologies, capabilities and facilities are presented in the best way.” This strategic expansion of the sales network of AT&S in the U.S. therefore guarantees a maximum customer satisfaction.
Subject to technological and economic requirements, AT&S offers high-end printed circuit boards specially tailored to customers’ needs: mainly multi-layer, HDI (high density interconnection, laser-drilled) any-layer, IMS (insulated metallic substrate), flexible, rigid-flex and semi-flexible as well as advanced packaging solutions with its patented embedding technology.
