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An Examination of Glass-fiber and Epoxy Interface Degradation in Printed Circuit Boards
July 12, 2019 | Bhanu Sood, Michael Osterman, and Michael Pecht, Center for Advanced Life Cycle EngineeringEstimated reading time: 9 minutes
1. Lathi, J.N., Delaney, R.H., and Hines, J.N. “The Characteristic Wear-out Process in Epoxy Glass Printed Circuits for High Density Electronic Packaging,” Reliability Physics 17th Annual Proceeding, pp. 39–43, 1979.
2. Sood, B., and Pecht, M. “Conductive filament formation in printed circuit boards: effects of reflow conditions and flame retardants,” Journal of Materials Science: Materials in Electronics, 22:1602–1615, 2011.
3. Rogers, K., Hillman, C., Pecht, M., and Nachbor, S. “Conductive Filament Formation Failure in a Printed Circuit Board,” Circuit World, Vol. 25 (3), pp. 6–8, 1999.
4. Lando, D.J., Mitchell, J.P., and Welsher, T.L. “Conductive Anodic Filaments in Reinforced Polymeric Dielectrics: Formation and Prevention,” Reliability Physics 17th Annual Proceeding, pp. 51–63, 1979.
5. Domeier, L., Davignon, J., and Newton, T. “A Survey of Moisture Absorption and Defects in PWB Materials,” Proceedings of the 1993 Fall IPC Meeting, pp. 3–5, 1993.
6. William, V. “Conductive Anodic Filament Resistant Resins,” Proceedings of the IPC Printed Circuits Expo, 2002.
7. Mack, H. “Choosing the Right Silane Adhesion Promoters for SMP Sealants,” Adhesive and Sealant Council Meeting in Orlando, Florida, 2001.
8. Rogers K. “An analytical and experimental investigation of filament formation in glass/epoxy composites,” ProQuest Dissertations and Theses, 2005.
9. Materne, T., de Buyl, F., and Witucki, G.L. “Organosilane Technology in Coating Applications: Review and Perspectives,” Dow Corning S.A. and Dow Corning Corporation, 2006.
10. Plueddemann, E. P. In Proc. ICCI-II. “Interfaces in polymer, ceramic, and metal matrix composites,” Hatsuo Ishida, Ed., pp. 17–33, 1988.
11. Hodzic, A., Kim, J. K., and Stachurski, Z. H. Polymer 42:5701-5710, 2001.
12. Gurumurthy, C. K., Kramer, E.J., and Hui, C.Y. “Hydro-Thermal Fatigue of Polymer Interfaces,” Acta Materialia, Vol. 49, pp. 3309–3320, 2001.
13. Ritter, J. E., and Huseinovic, A. “Adhesion and Reliability of Epoxy/Glass Interfaces,” Journal of Electronic Packaging, Vol. 123, pp. 401–403, 2001.
14. Leung, S.Y.Y., Lam, D.C.C., and Wong, C.P. “Experimental Investigation of Time Dependent Degradation of Coupling Agent Bonded Interfaces,” IEEE Electronic Components and Technology Conference, 2001.
Page 3 of 3Suggested Items
DuPont Showcases AI Innovations Featuring Advanced Interconnects at 2024 International Electronic Circuits Exhibition
05/13/2024 | DuPontDuPont announced it will showcase its comprehensive range of advanced circuit materials and solutions at the 2024 International Electronic Circuits Exhibition in Shanghai. With a product portfolio that includes fine line, signal integrity, power and thermal management, DuPont will exhibit at Booth #8L06 at the National Exhibition and Convention Center (NECC) from May 13 to 15.
MKS’ Atotech to Participate in ECTC
05/10/2024 | MKS’ AtotechAt this year’s 74th IEEE Electronic Components and Technology Conference (ECTC), MKS’ Atotech will present and demonstrate its latest product and service innovations.
The Chemical Connection: Reducing Etch System Water Usage, Part 2
05/02/2024 | Don Ball -- Column: The Chemical ConnectionIn my last column, I reviewed some relatively simple ways to reduce water usage in existing etch systems: cutting down cooling coil water flow, adding chillers to replace plant water for cooling, lowering flow rate nozzles for rinses, etc. This month, I’ll continue with more ways to control water usage in your etcher. Most of these are not easily retrofittable to existing equipment but should be given serious consideration when new equipment is contemplated. With the right combination of add-ons, it is possible to bring the amount of water used in an etch system to almost zero.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.