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A Twist on Printed Electronics: Printing on 3D Shapes

Barry Matties speaks with Optomec’s Pascal Pierra about their LENS printer systems and Aerosol Jet technology, which allows manufacturers to print applications like sensors and antennas on 3D objects. The process is significantly faster and greener than competing technologies.

Book Recommendation: The Inspiration Code—How the Best Leaders Energize People Every Day

Regardless of who you are, what you have done, where you have been, or where you are in your life journey, this book can help you to be inspirational. Not all of us are inspirational by nature; most of us are just regular people who have led regular lives. For the most part, we have done nothing dramatic enough to be inspirational just by our very existence.

Better Together: How HDP User Group Showcases the Industry’s Best Side

HDPUG is a non-profit trade organization comprised of members from top companies in the electronics industry, from materials suppliers and manufacturers, to OEMs and end users. Key activities include collaborating on issues facing multiple industries and bringing people together on projects who might not have met otherwise. Barry Matties met HDPUG’s European representative and project facilitator Alun Morgan at the recent EIPC Summer Conference to learn more about the group and current projects.

Embedding Active and Passive Components in Organic PCBs for More Reliability and Miniaturization

Hofmann Leiterplatten GmbH has developed a wide range of products in the last 25 years. New manufacturing know-how has been developed in fabricating organic PCB with embedded devices. A special name, AML (active multilayer), was created to differentiate the surface mount devices (SMD) and the device embedded technology (DET) PCBs. Manufacturing processes that are not typical for standard PCB fabrication shops has been developed.

14th Electronic Circuits World Convention

The 14th Electronic Circuits World Convention (ECWC14) started in Seoul to the usual fanfare after the opening ceremonies of KPCA 2017. The ribbon-cutting ceremony was conducted by KPCA’s Jung Bong Hong and the representatives of the other WECC members: WECC Secretary General Rex Rozario; Jin Zhangi (CPCA); Alun Morgan (EIPC); Vikram Desai (Electronic Industries Association of India); Canice Chung (Hong Kong PCA); David Bergman (IPC); Kushal Patel (IPCA); Toshifumi Kobayashi (JPCA), and Rich Wu (TPCA).

Happy Holden Second Recipient of I-Connect007 'Good for the Industry' Award

Our second 'Good for the Industry' award has been presented to Happy Holden. After working with Happy for a number of years it is clear to see that he is dedicated to improving the industry. He has a long history in the PCB industry, starting off with HP in the '70s. Not only did he develop HDI, but he then wrote the HDI Handbook, which is provided to readers at no charge.

President Donald Trump Launches Workforce Development Week

Earlier this week President Donald Trump announced “Workforce Development Week.” As such, President Trump spent the last four days promoting job creation and even signed executive order expanding apprenticeship programs.

Mitch Altman Discusses Bringing Youth into the PCB industry

Publisher Barry Matties is joined by Mitch Altman, creator of TV-B-Gone, a device that can turn off TVs in public, and co-founder of Noisebridge, an educational hackerspace based in San Francisco. In this interview, they discuss the importance of bringing youth into the PCB industry and how Noisebridge has inspired people of all ages to get started creating their own electronics.

Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 2

The second day saw the conference room full once more, the late networking session in the bar having resulted in no significant casualties, and I was pleased to accept the invitation to moderate the first session, on processes and materials for flexible PCBs.

Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1

Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.


Embedded Technology: It’s All Around Us

In the early ‘80s, the PCB company I worked for was testing some of the first material for buried resistors. I can’t recall what customer it was for, or how far along the project got, but over the years it seemed like the technology was slow to be adopted and perhaps ahead of its time.

Walt Custer’s Market Report

At the recent EIPC Conference, Walt Custer delivered his annual report detailing the trends he’s been seeing in the electronics industry for 2016 and into the first quarter of 2017. Barry Matties sat down with Walt to discuss his findings, including his forecast for the upcoming year. Also discussed are Walt’s prognosis for the market segments with the most promise and those that cause him concern.

Industry Knowledge—Preparing the Next Generation

Recruiting and retaining talent is becoming a monumental task in our industry. Look around at trade shows; there is a palpable decrease in the number of young people who are interested in engineering and/or manufacturing. With the advent of the IT age, the prospective workforce has moved on to the next natural step in the technological progression.

A Conversation with an Industry Twenty-Something

At a recent SMTA Expo, I met with Matt Hammesfahr, a salesperson with Amitron. Matt is young, by our industry standards—in his midtwenties. Just a few years out of college, Matt holds a business degree and is already a top salesman with the company. Here’s one of those twenty-somethings we keep saying we want to attract to our industry. How did this happen? I had to get the story.

How to Find –and Retain– the Right People for the Right Jobs

I sat down recently with Rebecca Brennan, director of human resources, and Aimee Miller, director of corporate communications for Compunetics and Compunetix. I already knew a little bit about their programs, having spent time at Compunetics in past years. I was looking forward to learning more about their methods.

HDP User Group 2017 European Meeting Highlights Technology Progress

The conference facility at the offices of Oracle, in the royal burgh of Linlithgow in West Lothian, Scotland, was the venue for the 2017 European meeting of the High Density Packaging User Group. I was delighted and privileged to be invited once again to sit in on the open session, an intense programme of technical presentations and discussions, project reviews, status updates and new project proposals.

Weiner’s World—May 2017

China’s central bank is effectively anchoring the yuan to the dollar, a policy twist that has helped stabilize the currency in a year of political transition and market jitters about China’s economic management. The yuan weakened more than 6% against the dollar in 2016; this year, it is up roughly 1%, and the expectation that the currency will fluctuate—a gauge known as implied volatility—is around its lowest in nearly two years.

David Dibble on the Hiring Process: Getting the Most From Systems Excellence

If this is the first time you’ve heard the name David Dibble, or his company, Dibble Leaders, then you’re in for a treat. David is one of our industry’s foremost thought leaders when it comes to systems optimization and leadership development. He has worked with many companies, both in our industry and in the medical field. From starting his own PCB company and growing it into a successful firm, David has a record of success.

The Sum of All Parts: Recruiting and Retaining Young Talent

Recruiting and retaining talent is becoming a monumental task in our industry. Look around at trade shows; there is a palpable decrease in the number of young people who are interested in engineering and/or manufacturing. With the advent of the IT age, the prospective workforce has moved on to the next natural step in the technological progression.

Innovator Bob Tarzwell Retires From PCB Industry to Focus on New Career in Art

I have known Bob Tarzwell for more than 18 years, since he first called me looking for some help with his company. His first words to me were, “Hi, my name is Bob Tarzwell and I own a shop in Carleton Place, Ontario. I need your help."


Ladle on Manufacturing: Testing Times Ahead

Bare board electrical test: For the most part, it does what it says on the tin. Current CAM software and test hardware means that in theory, it is a pretty simple exercise to make sure that a printed circuit matches the intended design. But are you getting the test you think you are?

Growth Ahead for Flexible Hybrid Electronics Industry

According to Zion Research, “global demand for the flexible electronics market was valued at $5.13B in 2015 and is expected to generate revenue of $16.5B by 2021, growing at a CAGR of slightly above 21% between 2016 and 2021.” Key elements of the market, in the view of most analysts, include flex displays, sensors, batteries, and memory.

Help Wanted With IMI’s Peter Bigelow

In preparation for this month’s topic, especially what companies in our industry are currently experiencing when it comes to finding and hiring the right people, I sought out Peter Bigelow, president and CEO of circuit board fabricator IMI Inc. We spoke in February at IPC APEX EXPO.

Deep Into Technology at Compunetics

There aren’t many printed circuit companies in my neck of the woods. There is one, however, that has always fascinated me, and that is Compunetics, in Monroeville, Pennsylvania, a suburb of Pittsburgh. Having worked with them on the electrophoretic photoresist, a PPG product, many years ago, it was great to stop by and catch up with CTO Tim Schmitt and Technical Applications Manager Jesse Ward, along with General Manager Burhan Capar, a relative newbie to the company.

Book Recommendation: You’ve Got 8 Seconds—Communication Secrets for a Distracted World

So, you’ve worked hard to get that appointment, and it has paid off. There you are sitting directly in front of “the man”—the guy you have been killing yourself to see for many months.

Rockwell Collins’ Doug Pauls Discusses Volunteering, Mentoring and Their Road Show

I was happy to see Rockwell Collins’ Doug Pauls receive IPC’s Raymond E. Pritchard Hall of Fame award at IPC APEX EXPO, well-deserved for him, and I wanted to chat with him about it. As with so many conversations at the conference this year, the talk quickly turned to inspiring interested young people in our “graying” industry. We also discussed the nature of volunteering and what we get out of it.

Ding Cheng of BYD Electronic: Embracing the FPC Factory Model of the Future

The topic of the third issue of PCB007 China Magazine is "The Wide World of Flex." Around this theme, we asked one of the leaders of China's FPC industry, Ding Cheng, general manager of the FPC Division of Shenzhen BYD Electronic Parts Company, to share his perspective about trends in flex, and where he thinks that market is headed in the future.

Executive Agent for PCB and Electronic Interconnect Technology PrCB Trust Accreditation

The DoD mandate for trust in the PrCB supply chain is mirrored in DoDI 5200.44, which states: “Employ protections that manage risk in the supply chain for components or subcomponent products and services (e.g., integrated circuits, FPGAs, PrCBs) when they are identifiable (to the supplier) as having a DoD end-use.” In response to congressional and DoD directives, the PrCB EA proposed pursuing a trust accreditation program for PrCB suppliers.

Help Wanted—and How!

It seems that I am extra-sensitive to topics in the news that coincide with an upcoming magazine topic—I see headlines in newspapers, suddenly the subject comes up in conversations, in email, and even in other media. And I think, is it just me or is everyone talking about this at the same time?

Weiner’s World—April 2017

China’s economy accelerated for a second straight quarter as investment picked up, retail sales rebounded, and factory output accelerated in March. Gross domestic product increased 6.9% in the first quarter from a year earlier, compared with a 6.8% median estimate in a Bloomberg survey.


Innovating in the Technology of Stretchable PCBs

Express Circuits is a long-established PCB fabricator located in Coleshill, near Birmingham in the Midlands of England, specialising in quick-turn complex prototype and small- to medium-volume microvia multilayer and rigid-flex. With the benefit of associate companies focused on design and assembly, Express is recognised for its exemplary customer service and technical support, as well as for its innovative manufacturing solutions.

Material Choices for High-Speed Flexible Circuits

Materials to make high-speed flexible circuits are now available from many material suppliers. In deciding which materials to test or use, remember the tradeoffs the suppliers made in categories we discussed: electrical properties, mechanical/flex properties, and ease of processing. A choice should only be made after considering these options. Remember with any new materials it is very important to find fabricators that are knowledgeable about processing these new materials.

IMPACT Washington 2017 Just Around the Corner

IPC's Government Relations team has worked around-the-clock to ensure that IMPACT Washington D.C. 2017 is the best yet. During this two-and-a-half day event, executives from IPC-member companies will have the opportunity to speak with leaders in Congress and the Administration in support of our common priorities.

Patty’s Perspective: Faster, Faster, Faster…or the Need for Speed, More Speed!

I wonder: Do we really need more speed in our connections? When will we hit that proverbial wall everyone worries about? Of course, if we want things like autonomous cars, intelligent robotics, and extended IoT, then we will continue to press forward—or rather you, the PCB manufacturer, designer, and supplier of high-speed materials will keep at it.

Fabricators Speak Out on High-Speed Materials

Recently, I-Connect007 Publisher Barry Matties and his editorial team joined with two PCB fabricators to discuss the state of advanced materials. The meeting included Gerry Partida, director of engineering at Summit Interconnect and Joe Menning, program manager at All Flex Flexible Circuits. The discussion centered on the processes, challenges, and procurement of high-speed materials, as well as need to work with customers during the design stage.

PCB Technology Requirements for Millimeter-Wave Interconnect and Antenna

The work done by Optiprint AG in support of MiWaveS substantiates that PCB technology can satisfy the engineering requirements for mmW circuitry providing the manufacturing capabilities can match the positional accuracy, feature tolerance and surface finish requirements.

Crucial Considerations for Building Flexible Heaters

An electronic heater is created by driving electric current through a resistive element. As the current is drawn through the element, some of the energy is expelled as heat. That heat can then be transferred to other surfaces with positive effects.

Capitol Connection: IMPACT Update—To CEOs on Why You Should Attend IMPACT Washington, D.C. 2017

Here at IPC, we place a high priority on making our presence known in the halls of government, because so many policy debates have a direct effect on the electronics manufacturing industry. IMPACT Washington, D.C. 2017 is a chance to join with fellow industry executives in advocating for better public policies for a stronger, more advanced manufacturing economy.

Mutracx Makes Green Operations Economically Viable

During IPC APEX EXPO, I sat down for an interview with with Jeroen de Groot, CEO of Mutracx. He detailed the company’s plans to install new equipment at a facility in Romania, and he explains why having a green manufacturing operation is not enough—it must also be economically feasible.

American Standard Circuits Discusses e-Book on Designing Flex and Rigid-Flex

American Standard Circuits is an industry leader when it comes to high-technology printed circuit boards, especially flex and rigid-flex printed circuit boards. So, it was natural that they would write about flex and rigid-flex for I-Connect007’s new “Guide to…” e-book series.


RTW IPC APEX EXPO: Sanjay Huprikar Lays Out Plans to Grow IPC Membership

Sanjay Huprikar, IPCs vice president of member success, discusses IPCs plans to expand membership around the world.

MACFEST: Benchmarking a New Solderable PCB Finish

New, innovative manufacturing procedures have been developed by the recently completed project, Manufacturing Advanced Coating for Future Electronics SysTems (MACFEST), which has been funded by several partners and the government’s Innovate UK.

RTW IPC APEX: HDPUG's Jack Fisher Discusses Updates on Optoelectronics Project

The HDPUG Optoelectronics project set out to demonstrate that optical waveguides incorporated within a backplane could benefit the system's interconnect topology. HDPUG facilitator Jack Fisher explains that a demonstrator has now been built and is currently under test at a number of leading OEMs.

Coast to Coast Circuits Talks Print-and-Etch Technology

I recently learned that a high-tech PCB supplier, Coast to Coast Circuits, had decided to provide their customers with quick-turn, high-value print-and-etch printed circuit boards. I talked with CEO Walt Stender and Marketing and Key Account Manager Michael Cisco, and I asked them to provide more details about this interesting decision.

Weiner’s World – March 2017

The CPCA show held at the China International PCB And Assembly Show was moderately busy even though the new venue was not quite ready (no escalators, the "water closets" not fully finished, the heat was only on for a few hours one day). It showcased products for PCB Manufacturing, Electronic Assembly Materials and Manufacturing Services.

RTW IPC APEX EXPO: atg Luther & Maelzer's Fully Automated Probe Testing for High-Throughput HDI PCB Production

Klaus Koziol, director of sales at atg Luther & Maelzer, explains the rationale behind the development of the newly-introduced A8A from atg and discusses how the latestinnovations in high-accuracy automatic testing deliver high throughput whilst retaining the flexibility of flying-probe techniques.

Stretching Beyond Flex

Emerging end-use electronic applications are driving dramatic innovations in circuit board and interconnection technology. New form factors, functionality and durability requirements are challenging the status quo for the PCB industry and pushing design, material and process development to the limit.

A Conversation with Gene Weiner

In a discussion following the PCB Executive Forum at IPC APEX EXPO in February, Gene Weiner opened up to Barry Matties and Patty Goldman on the state of the North American electronics industry supply chain and the importance of cooperative efforts up and down that supply chain.

RTW IPC APEX EXPO: New Dimensions in Fine-Pitch Probe Testing from Microcraft

MicroCraft introduces two new product lines. Regional Sales Manager Jesse Ziomek describes a flying-probe tester capable of hitting 0.4 mil pads at 2 mil pitch without sacrifice of testing speed, and a digital ink-jet printer able to print both solder resist and legend in the same cycle.

RTW IPC APEX EXPO: Updates on Formulations for Direct Imaging and Inkjet Technologies

Chris Wall, technical director and Shaun Tibbals, sales and marketing director at Electra Polymers, review latest developments in digital imaging technologies for solder resist. Multi-wave direct imaging systems give more scope to the ink supplier to optimize formulation and offer improved flexibility of operation to the user.


Capitol Connection: Drumroll, Please…Announcing the IPC Government IMPACT Awardees

Government relations are essential to our industry as many of the policy debates taking place will have long-lasting impact on our industry. Tax and regulations reform, immigration, and environmental regulations are up for debate and it is time for our industry to take a seat at the table.

EIPC Workshop on PCB BioMEMS

The Premier Inn conference centre at Heathrow Airport was the venue for the EIPC workshop on PCB BioMEMS. What, I hear you ask, is a PCB BioMEMS? This is an abbreviation for biomedical (or biological) microelectromechanical systems, otherwise known as lab-on-chip.

RTW IPC APEX EXPO: ERP System Helps Gardien Ensure Global Consistency in Quality Assurance Services

How does a global provider of quality assurance services to the PCB industry give its customers the peace of mind that no matter where they utilize its services that they will always be to the same consistent high standard? Gardien Global VP of Quality Rick Meraw explains the benefits of an in-house-developed ERP system in driving efficiency and best practice throughout the organization.

Mike Carano on the First PCB Executive Forum Held at IPC APEX EXPO 2017

When John Mitchell came on board as president of IPC, he decided to tap the members of the Raymond E. Pritchard Hall of Fame for suggestions and advice. So he established the IPC Ambassador Council and tasked them to create special programs for IPC conferences. It is this group of people who put together the recent PCB Executive Forum that was presented at IPC APEX EXPO 2017.

Inkjet Printing Solder Mask

Known for their film-based products, AgfaGevaert has turned its focus to the difficult task of inkjet printing solder mask by partnering with solder mask expert Electra Polymers. Sitting down with Frank Louwet and Mariana Van Dam of Agfa Specialty Products, Publisher Barry Matties and Technical Editor Pete Starkey learn more about the partnership and where they currently stand in the development of what will be a definite game changer.

RTW IPC APEX EXPO: John Davignon Offers HDPUG Update

The HDPUG (High-Density Packaging User Group) is an industry consortia designed to leverage members expertise to solve a variety of problems and issues affecting the electronics industry. Recent examples include the publication of project for the effects on back drilling on PTH reliability and reliability of press fit technology.

Ray Pritchard Looks Back at IPC’s Beginning and His Role in Getting it Started

I have known Ray Pritchard for a long time—as long as I’ve been involved with IPC, in fact. He directed the organization for 35 years before turning over the reins. One could say he grew up with the organization—or vice versa. Ray was always a bundle of energy and still is, still joking and warm, a great people person, and I am sure he had a little something to do with the spirit of camaraderie and cooperation that is the hallmark of the IPC we know today.

The Wide World of Flex

In one sense the flexible circuit industry has remained amazingly stable. Polyimide remains the workhorse dielectric film; imaging is done by exposing a pattern on a photosensitive film; copper is subtractively removed from a patterned substrate; and crylic adhesive is commonly used to laminate polyimide coverlay as an insulation. But there have also been some rather dramatic changes...

RTW IPC APEX EXPO: ELCINA Inducted as a Member of WECC

WECC, the World Electronics Circuits Council, brings together industry trade associations worldwide to address issues of global importance. Secretary General Rex Rozario introduces Paresh Vasani, Honorary Secretary of ELCINA, the electronics industry association representing 300 companies in India, newly inducted as a member of WECC, and they discuss the significance of the relationship in the light of rapidly accelerating growth of electronics manufacturing in India.

The Near and Far Future for Orbotech and Inspection

Orbotech’s PCB Division President Arik Gordon and I spoke in detail about the company’s newest developments in automated optical shaping (AOS), Orbotech’s unique culture and commitment to R&D, and what he expects to see in the near future for the inspection industy.


RTW CPCA: Helmut Fischer Discusses Solutions Approach in PCB Measurements

Dr. Wolfgang Babel, CEO and president of Helmut Fischer Group, discusses Industry 4.0, automation, and advanced solutions in PCB measurements.

RTW IPC APEX EXPO: HDPUG Discusses the Impact of Copper Bonding Treatment on Signal Integrity

Jim Fuller, vice president of engineering and technology development at Sanmina, gives an insight on how HDPUG, the High Density Packaging User Group, shares the experience and resources of member companies to tackle projects and get results, and reviews the study of the effect of copper bonding treatment on signal integrity.

Capitol Connection: Direct Legislative Action—IMPACT Washington, D.C. 2017

This ties in to why IPC–Association Connecting Electronics Industries invests so much into our government relations efforts. We place a high priority on government relations because so many public policy debates have large impacts on our industry. Our members continue to value our advocacy efforts on issues such as taxes, regulations, immigration and the environment.

Stay Flexible!

Now, isn’t that the mantra we all hear today? For me, it’s Tai Chi to maintain physical flexibility. But of course, that is not what we’re here for. We’re talking flexible circuits including all the variations of same, which is why we called this issue “The Wide World of Flex.” Because the world of flex is broad—and it’s rapidly getting wider.

RTW IPC APEX EXPO: American Standard Circuits Focuses on the Microwave Market

John Bushie, director of technology with American Standard Circuits, talks about the microwave market with Guest Editor Judy Warner. The discussion ranges from material types to market demand to the need for PCB designers to work closely with their board supplier.

RTW IPC APEX EXPO: Ventec Talks Benefits of High-Level OEM Tech Team

Managing Director of Ventec Europe, Thomas Michels comments upon the complementary non-copper-clad-laminate, one-stop-shopping opportunities that have resulted from the merger of the TMT business with the Ventec operation, and discusses the benefits of a strong integrated supply chain and a high-level team of OEM applications specialists in building long-term partnerships between Ventec and its customers.

RTW IPC APEX EXPO: Schmoll and Taiyo America Partner to Speed Up Solder Mask Development

How to accelerate the development of specialist direct-imaging solder resists to suit the requirements of the Asian and North American markets? Jesse Session, technical manager at Taiyo America, describes how close collaboration between ink formulator and equipment supplier enables the optimization to be achieved most effectively.

RTW CPCA Show 2017: ESI Discusses Latest Innovations in Laser Drilling

At the recent CPCA Show 2017 in Shanghai, China, Mike Jennings, director of marketing for flex and interconnect products at Electro Scientific Industries Inc. (ESI), highlights their expertise in laser drilling, as well as being the first roll-to-roll capable UV laser drill provider. He also talks about their recently released RedStone PCB laser processing system, a low cost-of-entry solution for FPC manufacturers considering the adoption of laser processing for flex PCB.

RTW IPC APEX EXPO: The Power of Synergies with MacDermid Enthone and Alpha Assembly Solutions

Don Cullen, global director of marketing communications with MacDermid Enthone, and Tom Hunsinger, VP global marketing with Alpha Assembly Solutions explain the structure of MacDermid Performance Solutions, which combines the former MacDermid, Enthone and Alpha Assembly Materials businesses to provide PCB and EMS industries with enhanced innovation and service throughout the supply chain, with unified sales strategies and improved processes.

RTW IPC APEX EXPO: Taiyo Discusses Option for PCB Heat Dissipation—Thermally Conductive Solder Resist

Conventional solder resists are relatively poor conductors of heat, but dense PCB assemblies generate heat that needs to be dissipated by all means possible. Don Monn, business development and European sales manager for Taiyo America, introduces a ceramic-filled formulation that increases thermal conductivity by a factor of 10 or more.


Industry 4.0–Inkjet Technology is Changing the World of PCB Manufacturing

When the Germans coined the term Industry 4.0 back in 2011, it wasn’t clear to many what it actually stood for. Although the debate about all the nuances of the term’s meaning is still ongoing, one aspect of it is undisputed: The “computerization of manufacturing” is at the heart of it.

RTW IPC APEX EXPO: IPC Validation Services Update

Randy Cherry, IPC's Director of Validations Services speaks with Guest Editor Judy Warner. Randy gives an update on the QML and QPL programs, including updates on the newest QPL program for copper clad laminates. They also discuss the growing value of industry engagement with VS as the number of certified facilities increases.

RTW IPC APEX EXPO: Ventec Discusses CCL Supply Chain Issue

Mark Goodwin, COO of USA and Europe for Ventec International Group, and Jack Pattie, CEO of Ventec USA, discuss the effect of current material issues on the supply chain for copper-clad laminate, comment upon prospects for the future and stress the importance of customer-supplier relationships in forecasting and planning requirements.

RTW IPC APEX EXPO: Orbotech Tackles Next-Gen Interconnection Density

Orbotech West President Sharon Cohen explains the company structure and philosophy—translating ideas into reality - and how, by understanding the issues driving PCB technology, Orbotech is able to provide the imaging and inspection tools to meet the needs of next-generation interconnection density.

Eagle Electronics: Success through 'Building Everything'

During a recent visit to Chicago, Editors Andy Shaughnessy and Patty Goldman stopped by Eagle Electronics just outside of Chicago. Chief Operating Officer Brett McCoy gave them a tour of the facility, and spoke about the company’s plans for the future, and why Eagle is bucking the niche market trend and manufacturing a wide variety of PCBs.
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