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Kevin O’Buckley to Lead Foundry Services at Intel

05/14/2024 | Intel Corporation
Intel Corporation announced the appointment of Kevin O’Buckley as senior vice president and general manager of Foundry Services, the customer service and ecosystem operations division of Intel Foundry. O’Buckley starts today and becomes a member of Intel’s executive leadership team reporting to CEO Pat Gelsinger.

SEMI Applauds U.S. CHIPS Act Award for Polar Semiconductor Facility in Minnesota

05/14/2024 | SEMI
SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, applauded the United States Department of Commerce’s announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support the expansion and modernization of Polar Semiconductor’s fab in Minnesota.

LPKF is Ready for Increasing Demand for Glass Substrates in the Semiconductor Industry

05/13/2024 | LPKF
The semiconductor industry is shifting towards glass to package the most advanced semiconductor chips. LPKF’s mature LIDE technology is enabling that transition into this new era from ramp-up to high volume manufacturing.

ASMC 2024 Opens With AI, Smart Manufacturing and Sustainability in Focus

05/13/2024 | SEMI
The 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024) opens today to focus on critical topics ranging from yield management and metrology to new developments in artificial intelligence, smart manufacturing and sustainability.

iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging

05/13/2024 | iNEMI
Advanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling.
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