Market Drivers and ESI’s Ongoing Developments

Reading time ( words)

In this video interview, part of the productronica 2019 coverage, Editor Nolan Johnson and Chris Ryder, director of product marketing at ESI, discuss the influences of market drivers on the ongoing development of ESI's products.

Chris discusses the dynamics and challenges that ESI sees in the marketplace, among them: new high-speed materials, quality requirements, chemical processes, and the challenges of delivering dramatically increased board densities while maintaining existing throughput. Chris also introduces us to Geode, a new machine that addresses these challenges as well as providing a smaller footprint for an increasingly crowded shop floor.

The productronica show is one of the world’s leading trade fairs for electronics development and production. The productronica trade fair is held on alternating years, at the Messe München in Munich, Germany. The next productronica will be held November 16-19, 2021.

Watch video below:

10/17/2019 | Andy Shaughnessy, I-Connect007

I recently sat down for an interview with Happy Holden, who is slated to give a keynote speech at this year’s AltiumLive event in Frankfurt, Germany. Happy gives a preview of his presentation, which is focused on smart factories and automation, and why artificial intelligence might improve PCB design and fabrication in the future.

10/09/2019 | Juha Saily, Focalspec Inc.

Line confocal sensors—and scanners based on them—are used in the imaging of surfaces, transparent materials, and multi-layered structures in various metrology and inspection applications on discrete parts, assemblies, webs, and other continuous products. Line confocal sensors operate at high speed and can be used to scan fast-moving surfaces in real-time as well as stationary product samples in the laboratory.

09/20/2019 | I-Connect007

Meet Dana Korf, one of our newest I-Connect007 columnists! Dana’s columns will focus on IPC-2581 as well as PCB front-end tooling, data quality, DFM processes, etc.