Happy New Year; Now Back to Work


Reading time ( words)

Welcome back! It’s January again, and it’s a brisk 10 degrees here in Atlanta. It’s so cold here that socialites have abandoned the veranda and taken their mint juleps into the parlor.

Yes, it’s time to get back into work mode. We ended the year on a good note, with unemployment down and almost 3 million jobs created in the first 11 months of 2015—the most for any similar period since 1999. There are still too many people working part-time who would like a full-time job, but the trend looks positive.

Show Time

During the week of February 22–26, it’s off to San Diego for IPC APEX EXPO and the Design Forum. (And three cheers for IPC moving APEX back to “America’s Finest City.” It’s hard to have a bad day in San Diego.) Appropriately, the Design Forum kicks off the week, with a keynote by Carl Schattke, a PCB design engineer with Tesla Motors. How many PCBs can you find in a Tesla?

To read this entire column, click here.

Share

Print


Suggested Items

EIPC Technical Snapshot Review: Semi-additive Processes

12/01/2021 | Pete Starkey, I-Connect007
The development of ultra-high-density PCBs and packaging substrates using semi-additive and additive manufacturing processes was the theme of the 13th Technical Snapshot webinar presented by EIPC on November 24. It was introduced and moderated by technical director Tarja Rapala-Virtanen. Daniel Schulze, application engineering manager at Dyconex in Switzerland, gave the opening presentation, “Advanced high density rigid packaging substrates for RF and miniaturization.” He explained that with their long-established capabilities in ultra-high-density PCBs in flex, rigid-flex and rigid multilayer technologies, it was logical for Dyconex to apply their expertise to the development of specialist IC substrates.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

04/23/2021 | Andy Shaughnessy, I-Connect007
This week, we bring you a wide swath of news, columns, and articles from the past week. Altium announced a new cloud platform that connects design stakeholders with users of its Altium 365 environment. Cadence Design Systems has acquired a company that develops computational fluid dynamics technology to help expand its system analysis offerings.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/05/2021 | Nolan Johnson, I-Connect007
A perennial and yet irregular category on the popular game show Jeopardy is “potpourri.” My dad, as I was growing up, pronounced the word as “pot-poury.” It wasn’t until I was a sophomore in college that my girlfriend’s mom—who had a penchant for a soupcon of French euphemism in her tête-à-têtes—pronounced the word properly: “po-pu-ree.” Such are the risks of growing up just a bit rural.



Copyright © 2022 I-Connect007. All rights reserved.