Smart Factories: More Than Robots
The acceptance of smart factories is a global movement across multiple industries. Even materials and chemistries are aligning with a move toward further automation, which allows equipment manufacturers to capture and store more data, and software layers to perform more detailed analysis, prediction, and optimization.
TTM on Flex and Rigid-flex PCB Challenges
One of the biggest bareboard manufacturers in the world, TTM Technologies has seen a recent surge in flex and rigid-flex demands from their customers. In this interview, Clay Zha, Vice President of Technology Solutions of TTM’s Mobility business unit, and VP of Corporate Marketing Winnie Ng discuss the differences in manufacturing flex versus traditional PCBs, and the increasing need for rigid-flex HDI boards.
NCAB Group on Supply Chain Issues
In an interview with I-Connect007, Wayne Antal, a key account manager with NCAB Group, discusses supply chain issues, the effect he sees on PCB fabrication channels, and how his customers are adapting to the new business dynamics.
Dan Gamota Discusses Flex and Alternative Substrates
As the VP of manufacturing technology and innovation for Jabil, Dan gave us his take on the current state of flex and alternative substrates and explained why modeling, automation, and process controls are likely to be key ingredients in the recipe for manufacturing non-FR-4 boards in the future.
RTW IPC APEX EXPO 2019: Insulectro Sees Growth and Opportunities in Printed Electronics
Judy Warner speaks with Tim Redfern, Insulectro president, and Kevin M. Miller, VP of sales, about growth in the printed electronics market, the direction Insulectro is going, and opportunities for North American PCB suppliers. They note that the company will increase their focus and investment in the printed electronics market.
RTW IPC APEX EXPO 2019: Limata Unveils Exciting Developments in LDI
Lino Sousa, sales, Limata, explains to Pete Starkey the latest developments in Limata’s laser direct imaging technology, which eliminates the need to change the solder mask.
Flex/MSTC Joint Conference: A Collaborative Week in Monterey
Collaboration filled the air at the Hyatt Regency in Monterey, California, as the 18th annual Flex/Mems&Sensors technical conference brought flex technology and sensor experts and 550+ attendees together to network and share ideas from February 18–21, 2019.
Chemical Recycling as Part of a Zero-effluent Strategy
Green manufacturing methodologies for PCBs are becoming a global shift. Green efforts have been underway in the European Union for quite some time. Likewise, in the United States, new PCB manufacturers are building zero-waste, zero-effluent facilities and gaining certification as such.
Institute of Circuit Technology Evening Seminar
The Institute of Circuit Technology hosted its first 2019 seminar at the Woodland Grange Hotel in Royal Leamington Spa in the Midlands of England on February 26. The diverse programme of four presentations was introduced by ICT Chairman Andy Cobley, a professor at Coventry University, who stood in for Bill Wilkie, who had been taken ill at short notice.
Gene Weiner on the IPC APEX EXPO 2019 Automotive Executive Forum
Dan Feinberg spoke with Gene Weiner, president and CEO of Weiner International Associates, about IPC's history of forums, his thoughts on the Executive Forum on Advancing Automotive Electronics at IPC APEX EXPO 2019, and how the IPC Hall of Famers and the industry can help improve forum success.
RTW IPC APEX EXPO 2019: Pluritec Partners: Information Systems, ECOSPRAY, & OCCLEPPO
Pluritec VP of Sales Lino Sousa discusses the history of Pluritec and its relationships with Information Systems and ECOSPRAY. He also announces the purchase of the assets and identity of OCCLEPPO, and describes the long-term plan for the integrated one-stop-shop.
Inspiring the Next Generation of Industry Leaders: IPC STEM Student Outreach Program
At IPC APEX EXPO 2019, I-Connect007 Managing Editor Patty Goldman spoke with Colette Buscemi, IPC's senior director for education programs, about the success and expansion of the IPC STEM Student Outreach Program, activities and scholarship opportunities for students through sponsor support—including I-Connect007—and feedback she received on the event.
Book Recommendation: GAP Selling
Get ready for the ride of your life because this book will rock your world. It is the best book on selling that I’ve read in 10 years, and I read all of them. This book debunks all of the so-called “axioms” about selling that you have heard throughout your career. The author “Keenan” (don’t ask, I didn’t) handles all of that sticky stuff that slows down—nay, just about kills—your sales effort.
NCAB Group on Supply Chain Issues
Wayne Antal, a key account manager with NCAB Group, discusses supply chain issues, the effect he sees on PCB fabrication channels, and how his customers are adapting to the new business dynamics. This is part one of a two-part conversation with Antal.
Selective Solder Mask Deposition by Inkjet
At IPC APEX EXPO 2019, Pete Starkey spoke with Joost Valeton, product manager for PiXDRO inkjet printing equipment with Meyer Burger, about their newly configured inkjet printer for PCB applications, and bringing awareness to opportunities using selective solder mask deposition.
RTW IPC APEX EXPO 2019: Super PCB Discusses High-end PCB Procurement Services
Kelly Dack speaks with Jessica Zhang, program manager for Super PCB, who focuses on serving customers with a small-business-type relationship. Based in Plano, Texas, Super PCB matches customer design requirements to a myriad of supplier capabilities through time-saving, direct communication with the supplier and best pricing.
Can E-waste and Metals Recovery Efforts Lower Environmental Risks and Liability?
Gold, palladium, silver, and other precious metals (PMs) in manufacturing wastes represent high value, but how PMs are recovered can pose environmental and liability issues. Aerospace and electronics manufacturers and suppliers, in particular, produce volumes of manufacturing wastes that contain varying levels of PMs.
RTW IPC APEX EXPO 2019: MacDermid Alpha on Affinity for ENIG
John Swanson, director of final finishes for MacDermid Alpha Electronics Solutions, speaks with I-Connect007 Guest Editor Kelly Dack about the ENIG finish process and their new product Affinity, which smooths out the challenges of the process.
Book Recommendation: The Greatest Salesman in the World
If you haven’t read this classic yet, it’s high time that you did; it’s an oldie but a goodie. Obviously, from the title, you can guess that it is a bit dated (please excuse the term “salesman”). Good, I’m glad we got that out of the way.
RTW IPC APEX EXPO 2019: CBT and Technica’s Relationship, Roadmap, and Equipment
Pete Starkey speaks with David J. Clark, CBT project director, and Najib Khan, photoimaging product manager at Technica, who explain the background of their companies and their current working relationship. Further, they address their technology roadmap, and the unique features of their direct imaging equipment—particularly the registration accuracy that can be achieved.
RTW IPC APEX EXPO 2019: Uyemura Discusses Heavy Gold Deposition
Richard DePoto, business development manager at Uyemura, brings Pete Starkey up to speed with the success of the heavy gold deposition process they discussed last year. It has been seamlessly integrated into standard ENEPIG lines to give a choice of finishes, and how advances in electroless palladium have enabled the elimination of electroless nickel for high-speed signal integrity.
RTW IPC APEX EXPO 2019: The Circle Is Complete
Jesse Ziomek, sales specialist for North and South America at DIS Inc., speaks with I-Connect007 Technical Editor Pete Starkey on the growth of the company in the global market, and how DIS continues to make life easier for fabricators of rigid, flex, and rigid-flex multilayers by showing them the benefits of their pinless registration systems.
RTW IPC APEX EXPO 2019: LPKF Highlights Laser Processing Tech, Glass Drilling Capabilities
Guest Editor Joe Fjelstad sits down with Stephan H. Schmidt, LPKF president, who provides an overview of the company's laser processing machine and their capabilities, and highlights the new glass drilling capabilities.
RTW IPC APEX EXPO 2019: New IPC Technical Education Program Manager
Brook Sandy-Smith discusses her new role as IPC technical education program manager, which is also a brand-new IPC position. She further explains the benefits of membership, when a member should contact her, the IPC STEM Outreach Program, and upcoming events.
RTW IPC APEX EXPO 2019: Taiyo Discusses New Solder Masks and Photoimageables
Donald Monn, Midwest regional sales manager for Taiyo America, turns the tables on I-Connect007 Technical Editor Pete Starkey and quizzes him about his knowledge of Taiyo's new crack-resistant white solder mask for automotive, and the company's standard photoimageables re-formulated for laser direct imaging (LDI) that avoid the need for UL requalification.
RTW IPC APEX EXPO 2019: Ventec's Goodwin on Global Technology Directions
Mark Goodwin, Ventec International Group CEO EMEA and USA, comments on technology directions globally and in the North American market. He also explains how Ventec's quality accreditations, technical expertise, and flexible manufacturing capacity continue to strengthen their leading position.
CES 2019: More Show Floor Favorites
In my final piece covering CES 2019, I will review more automotive technology, updates on 3D printing, and some trending devices such as smartwatches and new computer components for those that either need or just want to have extremely powerful and impressive-looking computers.
RTW IPC APEX EXPO 2019: Atotech Discusses Developments in Metallization Chemistries
Roger Massey, technical marketing manager at Atotech, and Technical Editor Pete Starkey discuss the challenges technologists face as circuit lines and spaces get smaller and smaller, and the latest developments in metallization chemistries to help customers address these issues.
IPC APEX EXPO 2019: It's a Wrap!
The IPC APEX EXPO 2019 show floor closed yesterday with applause. After three days of meetings, networking, and tire kicking, if you will, exhibitors head back to their offices with a list of leads, to-do lists, and stories to share. Meanwhile, attendees now head home with important decisions to make about what they learned and who they want to do business with.
RTW IPC APEX EXPO 2019: Ventec Highlights Core Solutions for Thermal Management
Jack Pattie, president of Ventec International Group, speaks with I-Connect007 Guest Editor Kelly Dack about the many heat issues associated with circuit boards right now—whether in general applications, power applications, PCs—as everyone demands smaller, faster, and more powerful systems.
RTW IPC APEX EXPO 2019: Updates on Taiyo’s Inkjet Solder Mask
Donald Monn, regional sales manager at Taiyo America, speaks with I-Connect007 Technical Editor Pete Starkey about the latest updates in their inkjet solder masks, and the many installations around the world that they are seeing for their product.
AltiumLive Munich: Day 2 Keynotes
Having enjoyed the conference dinner and robot battles of the previous evening, a good night’s sleep, and a hearty breakfast, Altium’s family of over 220 electronics engineers and designers eagerly returned to the conference room. Many jostled to secure the best seats for the second day of the European AltiumLive design summit in Munich, keen to make the most of the “learn, connect, and get inspired” opportunity it offered.
Laser Focus on Flex and Rigid-flex
ESI’s Chris Ryder, director of Product Management, and Shane Noel, Flex Systems product manager, discuss laser vias for flex users and the increasing necessity for companies to collaborate early on and become more and more involved, whether that be in the product design, or with the process or base material manufacturers.
Atotech at HKPCA on Announcements and Advancements
Edy Yu, managing editor for PCB007 China, caught up with Daniel Schmidt, Atotech’s director of global marketing, during the 2018 HKPCA and IPC Show in December. Edy and Daniel discussed Atotech’s new announcements at the show including their new solutions for 5G, high-speed, and high-frequency applications, and more.
Catching Up with Artnet Pro
I recently caught up with my old friend Meir Polack, co-owner with Rony Hod of Artnet Pro, which is a high-tech equipment sales and service company with offices in the U.S., China, and South America. We discussed a new line of direct imaging equipment called Altix (also the name of the company).
ESI’s Chris Ryder: There’s More to Choosing a Laser Than You Think
At the recent HKPCA show, I sat down with ESI’s Chris Ryder, director of product management—HDI—to discuss considerations for choosing a new laser system, and how ESI uses its decades of flex and rigid-flex drilling experience to help guide customers in their decision-making process.
CES Press Day: NVIDIA, Samsung, and Intel
Three major companies—NVIDIA, Samsung, and Intel—had lengthy, interesting presentations on CES press day, and each had with their own agenda.
Agfa on Revolutionary Inkjet Solder Mask Applications
Does inkjet solder mask have the potential for volume production? Mariana Van Dam, global sales manager for PCB imaging solutions, and Dr. Frank Louwet, business unit manager for advanced coatings and chemicals, discuss Agfa's latest developments, plus some novel applications for inkjet etch and plating resists.
Better to Light a Candle: Chapter One—Prepping the Next Generation
There has been a considerable amount of (electronic) ink and words shared in our industry bemoaning the graying-out of our industry and the growing shortage of skilled people at all levels. (See the May 2017 PCB007 Magazine column “Help Wanted—and How!” for just one example). As is usually the case, though, when all is said and done, more has been said than done.
Robert Art on the Importance of Thermal Management
Robert Art, global account manager for IMS materials at Ventec International Group, discusses future market requirements for thermal management materials, the need for a better understanding of the concept of thermal impedance, and an initiative to propose a consistent industry-standard method for measuring thermal conductivity while at electronica 2018.
Chris Nuttall Discusses NCAB Group's IPO and Future Plans
Editor Nolan Johnson sat down with Chris Nuttall, COO and VP of technology at NCAB Group, to discuss software tools, predictive reports, and the company's recent IPO.
The Shape of Things to Come: Curved, Flexible, Stretchable, and Three-Dimensional Electronics
The seamless integration of electronics into flexible, curved, and even stretchable surfaces is being requested for several markets, such as automotive (dashboards, lighting, sensors), smart buildings (lighting facades, air quality, solar panels), medical (health patches, X-ray, analysis), and smart clothing (position tracking, sports).
Successful Flex Circuit Design and Processing Guidelines
With the use of sensors and technology in everything from mobile phones to refrigerators, automobiles, and wearable medical devices, circuit boards are a component in many different types of products. In today’s world of electronics, any product with an on-off switch contains a circuit board.
Ventec's Marketing Strategy and Their Newly Appointed Technology Ambassador
At electronica 2018, Mark Goodwin, chief operating officer at Ventec International Group, discusses the company’s marketing strategy along with their newly appointed technology ambassador, Alun Morgan, and how he sees the world.